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  • English


SikaBond®-T100 may be used for solid and engineered wood floors (strips, longstrips, planks, panels, boards), mosaic parquet, industrial parquet, wood paving (residential) as well as chip boards and plywood. Once cured, SikaBond®-T100 will generate a super strong bond to a variety of substrates for glue down installations and at the same time form a membrane which reduces moisture vapor transmission from the subfloor and sound reduction membrane.


  • 150% Elongation
  • Bonds up to 3/4" solid and engineered wood
  • Cleans off prefinished floors before and after cure
  • Unlimited subfloor moisture vapor protection
  • No moisture testing required - a dry to touch substrate is the only requirement
  • Contains no water, solvent or isocyanates
  • Low moisture vapor permeability
  • Sound protection - meets local IIC and STC requirements
  • Crack Bridging
  • Very easy to spread
  • Low odor
  • Advanced Hybrid Technology
  • Excellent green grab
  • High elongation
  • Permanently elastic - allows planks to expand and contract without damage to the adhesive
  • Tenacious Bonding
  • Passes USGBC LEED Version 4


4 gal. (15.14 L)


Off - white

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